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Cooling System, Substrate Processing Apparatus, Substrate Processing Method, Method of Manufacturing Semiconductor Device and Non-transitory Computer-readable Recording Medium

발명심사 중
20청구항 · 4 독립항
§ Ⅰ

개요

발명자

Akira TAKAHASHI; Shin HIYAMA

IPC 분류

F28F 13/6H1L 21/324H1L 21/67

CPC 분류

F28F13/6H1L21/324H1L21/67109

To improve the cooling efficiency of a substrate, a cooling system includes: a vessel with a support capable of supporting a plurality of substrates in a multistage manner; and a plurality of cooling nozzles arranged along an inner surface of the vessel, wherein each of the plurality of cooling nozzles includes a gas supply hole through which a cooling gas is supplied for the plurality of substrates supported by the support, wherein a first cooling nozzle and a second cooling nozzle among the plurality of cooling nozzles are configured such that the cooling gas is supplied for a first substrate among the plurality of substrates through the gas supply hole of the first cooling nozzle, and the cooling gas is supplied for a second substrate other than the first substrate among the plurality of substrates through the gas supply hole of the second cooling nozzle.

원문 (중국어)

To improve the cooling efficiency of a substrate, a cooling system includes: a vessel with a support capable of supporting a plurality of substrates in a multistage manner; and a plurality of cooling nozzles arranged along an inner surface of the vessel, wherein each of the plurality of cooling nozzles includes a gas supply hole through which a cooling gas is supplied for the plurality of substrates supported by the support, wherein a first cooling nozzle and a second cooling nozzle among the plurality of cooling nozzles are configured such that the cooling gas is supplied for a first substrate among the plurality of substrates through the gas supply hole of the first cooling nozzle, and the cooling gas is supplied for a second substrate other than the first substrate among the plurality of substrates through the gas supply hole of the second cooling nozzle.