METHOD FOR PREPARING SUPPORTING SPRING MODEL AND INTEGRATED INTERFEROMETER DEVICE
개요
출원인
Harbin Institute of Technology, Shenzhen (Shenzhen Institute of Science and Technology Innovation, H
발명자
Gaopeng XUE; Honglin QIAN; Bing LI
IPC 분류
CPC 분류
A method for preparing a supporting spring model and an integrated interferometer device are provided, which relates to the technical field of infrared spectrometers. The method includes the following steps: multiple groups of initial control point coordinate sequences, which are determined based on a second-order Bezier curve and are configured to simulate control point coordinates of a supporting spring model, are iterated by using a genetic algorithm; and a supporting spring model for preparing a supporting spring structure in an integrated interferometer device is determined. The supporting spring model are simulated and iterated, so as to improve an optical path difference of the integrated interferometer device and further improve a resolution of the infrared spectrometer. The interferometer device includes a component layer, a buried oxide layer and a substrate layer. Reflectors are integrated with the substrate layer without installing the reflectors additionally.
원문 (중국어)
A method for preparing a supporting spring model and an integrated interferometer device are provided, which relates to the technical field of infrared spectrometers. The method includes the following steps: multiple groups of initial control point coordinate sequences, which are determined based on a second-order Bezier curve and are configured to simulate control point coordinates of a supporting spring model, are iterated by using a genetic algorithm; and a supporting spring model for preparing a supporting spring structure in an integrated interferometer device is determined. The supporting spring model are simulated and iterated, so as to improve an optical path difference of the integrated interferometer device and further improve a resolution of the infrared spectrometer. The interferometer device includes a component layer, a buried oxide layer and a substrate layer. Reflectors are integrated with the substrate layer without installing the reflectors additionally.