Multi-Channel Workpiece Inspection System
개요
발명자
Edward Robert Van Brunt; Jared A. Langan; Charles Henry Van Brackle
IPC 분류
CPC 분류
Described herein are systems and methods relating to inspecting semiconductor workpieces. In one example, the inspection system includes a first channel having a first imaging device configured to image the semiconductor workpiece on the workpiece using a first radiation source. The inspection system includes a second channel having a second imaging device configured to image the semiconductor workpiece on the workpiece holder using a second radiation source.
원문 (중국어)
Described herein are systems and methods relating to inspecting semiconductor workpieces. In one example, the inspection system includes a first channel having a first imaging device configured to image the semiconductor workpiece on the workpiece using a first radiation source. The inspection system includes a second channel having a second imaging device configured to image the semiconductor workpiece on the workpiece holder using a second radiation source.