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기록
METHODS AND APPARATUSES FOR TESTING MULTI-DIE PACKAGE INTER-CONNECT LINKS
발명심사 중
3조회수
20청구항 · 3 독립항
§ Ⅰ
개요
발명자
Rakesh KANDULA; Sriram VENKATESAN; Jeffrey SORIANO; Deep BAROT; Takeshi NAKAZAWA
IPC 분류
G1R 31/28
CPC 분류
G1R31/2853G1R31/2896
In some embodiments, techniques for testing die to die interconnect links are provided.
원문 (중국어)
In some embodiments, techniques for testing die to die interconnect links are provided.