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기록

DETECTION OF STRUCTURAL DEFECTS IN AN INTEGRATED CIRCUIT

발명심사 중
3조회수
25청구항 · 3 독립항
§ Ⅰ

개요

IPC 분류

G1R 31/28H1L 23/10

CPC 분류

G1R31/2884G1R31/2843H1L23/10

The integrated circuit is equipped with an annular wall including, in a first part, an alternation of conductive stacks containing metal tracks distributed over several metal levels and having an alternately reversed trapezoidal longitudinal section, all these tracks forming together at least one electrically conductive path having at least one staircase portion in a second part of the wall. Defect-detection circuit are located in the integrated circuit and connected to semiconductor zones buried in the substrate under the second part of the wall and connected to the two ends of the at least one electrically conductive path.

원문 (중국어)

The integrated circuit is equipped with an annular wall including, in a first part, an alternation of conductive stacks containing metal tracks distributed over several metal levels and having an alternately reversed trapezoidal longitudinal section, all these tracks forming together at least one electrically conductive path having at least one staircase portion in a second part of the wall. Defect-detection circuit are located in the integrated circuit and connected to semiconductor zones buried in the substrate under the second part of the wall and connected to the two ends of the at least one electrically conductive path.