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기록

MEMORY DAMAGE DETECTION DURING INTEGRATED CIRCUIT DEVICE BOOT

발명심사 중
3조회수
20청구항 · 2 독립항
§ Ⅰ

개요

발명자

Hui Li; Yifan He; Xiong Yan

IPC 분류

G1R 31/3187G1R 31/28G6F 21/57

CPC 분류

G1R31/3187G1R31/2853G6F21/575

Detecting damage to a memory of an integrated circuit device includes initiating a boot process of the integrated circuit device. The boot process is implemented by a boot processor of the integrated circuit device. As part of the boot process, a die crack test of a memory device of the integrated circuit device is initiated. The memory device is coupled to the boot processor. The boot processor receives a result of the die crack test of the memory device during the boot process. The result of the die crack test is stored in a register of the integrated circuit device.

원문 (중국어)

Detecting damage to a memory of an integrated circuit device includes initiating a boot process of the integrated circuit device. The boot process is implemented by a boot processor of the integrated circuit device. As part of the boot process, a die crack test of a memory device of the integrated circuit device is initiated. The memory device is coupled to the boot processor. The boot processor receives a result of the die crack test of the memory device during the boot process. The result of the die crack test is stored in a register of the integrated circuit device.