LOW-POWER SENSORS UTILIZING WIEGAND COILS
개요
발명자
Paul A. David; Alexander Latham; Ronald Lehndorff
IPC 분류
CPC 분류
Systems, structures, circuits, packages and methods provide low-power devices such as sensors and sensor packages having one or more Wiegand coils that can be used for activation of a sensor or other device, as well as potentially supplying operating power. In some embodiments, one or more Wiegand coils can be located in a sensor package, e.g., as one or more discrete components in the package and/or on formed on or connected to a semiconductor die within the package, for providing wake-up and/or continuous power. The Wiegand coil(s) can be separated from the sensor die in some embodiments. In some embodiments, the Wiegand coil(s) can be constructed on the die itself.
원문 (중국어)
Systems, structures, circuits, packages and methods provide low-power devices such as sensors and sensor packages having one or more Wiegand coils that can be used for activation of a sensor or other device, as well as potentially supplying operating power. In some embodiments, one or more Wiegand coils can be located in a sensor package, e.g., as one or more discrete components in the package and/or on formed on or connected to a semiconductor die within the package, for providing wake-up and/or continuous power. The Wiegand coil(s) can be separated from the sensor die in some embodiments. In some embodiments, the Wiegand coil(s) can be constructed on the die itself.