OPTICAL DEVICES AND METHODS OF MANUFACTURE

원문 (중국어)

A semiconductor package including a photonic package coupled to a first side of a package substrate, the photonic package including a semiconductor substrate, an array including multiple rows of coupling lenses on a top surface of the semiconductor substrate, and multiple rows of couplers disposed below the multiple rows of coupling lenses, where each coupler of the multiple rows of couplers is disposed below a corresponding coupling lens of the multiple rows of coupling lenses, first conductive connectors disposed between the photonic package and the first side of the package substrate, where the first conductive connectors are attached to first bond pads on the first side of the package substrate, and where at least one of the first conductive connectors includes a first intermetallic region, and second conductive connectors disposed on a second side of the package substrate that is opposite the first side.