PACKAGE HAVING COMPONENT CARRIER AND EMBEDDED OPTICAL AND ELECTRIC CHIPS WITH HORIZONTAL SIGNAL PATH IN BETWEEN
개요
출원인
AT & S Austria Technologie & Systemtechnik Aktiengesellschaft
발명자
Tanja JOERG; Erich SCHLAFFER
IPC 분류
CPC 분류
Provided is a package having a component carrier with at least one electrically conductive layer structure and/or at least one electrically insulating layer structure, and an optical chip and an electric chip being functionally coupled with each other and being embedded side-by-side in the component carrier so that a signal path between the optical chip and the electric chip is within a horizontal plane.
원문 (중국어)
Provided is a package having a component carrier with at least one electrically conductive layer structure and/or at least one electrically insulating layer structure, and an optical chip and an electric chip being functionally coupled with each other and being embedded side-by-side in the component carrier so that a signal path between the optical chip and the electric chip is within a horizontal plane.