PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN LAYER, AND SEMICONDUCTOR DEVICE USING THE SAME
개요
발명자
Sang Soo KIM; Taek-Jin BAEK; Heekyoung KANG; Jinhee KANG; Jiyu KIM; Mingyum KIM; Chungbeum HONG; Byeongwook PARK; Yushin PARK
IPC 분류
CPC 분류
A photosensitive resin composition, a photosensitive resin layer manufactured using the photosensitive resin composition, and a semiconductor device including the photosensitive resin layer are provided. The photosensitive resin composition includes (A) a resin, (B) a photopolymerizable compound, (C) a photopolymerization initiator, and (D) a solvent. The photopolymerizable compound includes a compound represented by Chemical Formula 1.
원문 (중국어)
A photosensitive resin composition, a photosensitive resin layer manufactured using the photosensitive resin composition, and a semiconductor device including the photosensitive resin layer are provided. The photosensitive resin composition includes (A) a resin, (B) a photopolymerizable compound, (C) a photopolymerization initiator, and (D) a solvent. The photopolymerizable compound includes a compound represented by Chemical Formula 1.