METHOD FOR MANUFACTURING CURED FILM
개요
발명자
Hiroaki Idei; Norifumi Yokoyama
IPC 분류
CPC 분류
The present invention provides a method for manufacturing a cured film, in which positioning of a mask during exposure is easily performed and antireflection characteristics of the cured film to be obtained are excellent. The method for manufacturing a cured film of the present invention includes a step 1 of forming a curable composition layer on a support, a step 2 of performing registration between the support and an exposure mask, a step 3 of exposing the curable composition layer through the exposure mask, a step 4 of performing a development treatment on the curable composition layer after the exposure to form a cured film in a patterned shape, and a step 5 of performing a heating treatment on the patterned cured film, in which the curable composition contains a resin A, a resin B, and a polymerizable compound, an HSP distance between the resin A and the resin B is more than 1.5 MPa, and an HSP distance (A) between the resin A and the polymerizable compound is larger than an HSP distance (B) between the resin B and the polymerizable compound.
원문 (중국어)
The present invention provides a method for manufacturing a cured film, in which positioning of a mask during exposure is easily performed and antireflection characteristics of the cured film to be obtained are excellent. The method for manufacturing a cured film of the present invention includes a step 1 of forming a curable composition layer on a support, a step 2 of performing registration between the support and an exposure mask, a step 3 of exposing the curable composition layer through the exposure mask, a step 4 of performing a development treatment on the curable composition layer after the exposure to form a cured film in a patterned shape, and a step 5 of performing a heating treatment on the patterned cured film, in which the curable composition contains a resin A, a resin B, and a polymerizable compound, an HSP distance between the resin A and the resin B is more than 1.5 MPa, and an HSP distance (A) between the resin A and the polymerizable compound is larger than an HSP distance (B) between the resin B and the polymerizable compound.