RESIN COMPOSITION, DIAMINE COMPOUND, CURED SUBSTANCE, LAMINATE, MANUFACTURING METHOD FOR CURED SUBSTANCE, MANUFACTURING METHOD FOR LAMINATE, MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE
개요
발명자
Michihiro Ogawa; Atsuyasu Nozaki
IPC 분류
CPC 분류
A resin composition containing a resin that contains a specific repeating unit and a group having an ethylenically unsaturated bond, in which a content of a phenolic hydroxyl group is 0.250 mmol/g or less, and a polymerizable compound having an ethylenically unsaturated bond, a cured substance obtained by curing the resin composition, a laminate including the cured substance, a manufacturing method for the cured substance, a manufacturing method for a laminate, a manufacturing method for a semiconductor device including the manufacturing method for a cured substance, and a semiconductor device including the cured substance, and a diamine compound having a specific structure.
원문 (중국어)
A resin composition containing a resin that contains a specific repeating unit and a group having an ethylenically unsaturated bond, in which a content of a phenolic hydroxyl group is 0.250 mmol/g or less, and a polymerizable compound having an ethylenically unsaturated bond, a cured substance obtained by curing the resin composition, a laminate including the cured substance, a manufacturing method for the cured substance, a manufacturing method for a laminate, a manufacturing method for a semiconductor device including the manufacturing method for a cured substance, and a semiconductor device including the cured substance, and a diamine compound having a specific structure.