CNIPA.AI
검색으로 돌아가기
기록

PASSIVE TEMPERATURE INDICATOR FOR A MODULE

발명심사 중
20청구항 · 2 독립항
§ Ⅰ

개요

발명자

PER HENRIK FREMROT; SHREE RATHINASAMY; THOMAS J. DEPARI; GREGORY M. ALLEN

IPC 분류

G6F 11/30G1K 11/12H1R 13/66

CPC 분류

G6F11/3058G1K11/12H1R13/6683

Devices, systems, and methods for managing a module for use with a chassis are disclosed. The module may include a body, a hardware component, positioned in the body, that consumes power to contribute to computer-implemented services provided by a data processing system housed by the chassis and that generates heat, a connector adapted to operably connect the hardware component to other hardware components of the data processing system, and a passive temperature indicator adapted to visually indicate a thermal state of at least a portion of the body.

원문 (중국어)

Devices, systems, and methods for managing a module for use with a chassis are disclosed. The module may include a body, a hardware component, positioned in the body, that consumes power to contribute to computer-implemented services provided by a data processing system housed by the chassis and that generates heat, a connector adapted to operably connect the hardware component to other hardware components of the data processing system, and a passive temperature indicator adapted to visually indicate a thermal state of at least a portion of the body.