METHOD AND APPARATUS FOR INSPECTING A WAFER
개요
출원인
Taiwan Semiconductor Manufacturing Company Limited
발명자
Yi-Hsi Chen; Cheng-Hung Chen; Chia Han Wu; Yen-Chia Liu; Hsu-Shui Liu
IPC 분류
CPC 분류
A method includes generating coherent light that has a wavefront, shaping the wavefront of the coherent light to provide the coherent light with a shaped wavefront, directing a probe beam of the coherent light with the shaped wavefront to an inspection surface of a wafer, causing a reflection beam to be reflected from the inspection surface of the wafer, capturing an image formed from the reflection beam reflected from the inspection surface of the wafer and generating image data related to the image, and analyzing the image data to determine whether there is a defect in the inspection surface of the wafer.
원문 (중국어)
A method includes generating coherent light that has a wavefront, shaping the wavefront of the coherent light to provide the coherent light with a shaped wavefront, directing a probe beam of the coherent light with the shaped wavefront to an inspection surface of a wafer, causing a reflection beam to be reflected from the inspection surface of the wafer, capturing an image formed from the reflection beam reflected from the inspection surface of the wafer and generating image data related to the image, and analyzing the image data to determine whether there is a defect in the inspection surface of the wafer.