CNIPA.AI
검색으로 돌아가기
기록

MANUFACTURING APPARATUS FOR ENAMELED COPPER WIRE AND MANUFACTURING METHOD FOR ENAMELED COPPER WIRE

발명심사 중
4청구항 · 2 독립항
§ Ⅰ

개요

발명자

Akira SETOGAWA; Hajime NISHI; Takami USHIWATA; Yuki HONDA; Takumi SATO; Sohei KODAMA

IPC 분류

H1B 13/6H1B 13/

CPC 분류

H1B13/65H1B13/3H1B13/16H1B13/36

A manufacturing apparatus for an enameled copper wire of the present disclosure includes: a coating material application section configured to apply a coating material to a surface of a conductor in traveling; a baking section configured to bake the conductor to which the coating material has been applied; and a dehumidifying section configured to set an absolute humidity in a space in which the manufacturing apparatus is installed to 18 g/mor less.

원문 (중국어)

A manufacturing apparatus for an enameled copper wire of the present disclosure includes: a coating material application section configured to apply a coating material to a surface of a conductor in traveling; a baking section configured to bake the conductor to which the coating material has been applied; and a dehumidifying section configured to set an absolute humidity in a space in which the manufacturing apparatus is installed to 18 g/mor less.