SUBSTRATE PROCESSING METHOD
개요
발명자
Kota TANIKAWA; Manabu TAKUSARI; Hiroyuki YASHIKI
IPC 분류
CPC 분류
A substrate processing method includes: holding a substrate having a first main surface and a second main surface; rotating the substrate and supplying a hydrofluoric acid-containing liquid to the second main surface of the substrate, the hydrofluoric acid-containing liquid containing hydrofluoric acid; after supplying the hydrofluoric acid-containing liquid to the second main surface of the substrate, rotating the substrate and supplying a rinse liquid to the second main surface of the substrate; and after supplying the rinse liquid to the second main surface of the substrate, rotating the substrate and supplying a hydrophobizing liquid to the first main surface of the substrate.
원문 (중국어)
A substrate processing method includes: holding a substrate having a first main surface and a second main surface; rotating the substrate and supplying a hydrofluoric acid-containing liquid to the second main surface of the substrate, the hydrofluoric acid-containing liquid containing hydrofluoric acid; after supplying the hydrofluoric acid-containing liquid to the second main surface of the substrate, rotating the substrate and supplying a rinse liquid to the second main surface of the substrate; and after supplying the rinse liquid to the second main surface of the substrate, rotating the substrate and supplying a hydrophobizing liquid to the first main surface of the substrate.