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기록

System and Method for Improving Atomic Layer Etching Performance

발명심사 중
20청구항 · 3 독립항
§ Ⅰ

개요

IPC 분류

H1L 21/3065C23C 14/34C23C 14/54G5B 19/4099H1J 37/32H1J 37/34

CPC 분류

H1L21/30655C23C14/345C23C14/54G5B19/4099H1J37/321H1J37/32449H1J37/32926H1J37/34G5B2219/45031H1J2237/332H1J2237/3341

Disclosed herein are systems and methods for enhancing atomic layer etching (ALE) in semiconductor manufacturing. It focuses on eliminating reactive ion etching (RIE) components during the surface modification step, a key challenge in conventional ALE processes. By integrating a switch mechanism for a blocking capacitor in a path between a bias unit and a chuck, this method significantly improves etching precision and efficiency. The invention can be readily extended to other etching or deposition applications, wherein a surface modification is required without ion interactions with a substrate surface.

원문 (중국어)

Disclosed herein are systems and methods for enhancing atomic layer etching (ALE) in semiconductor manufacturing. It focuses on eliminating reactive ion etching (RIE) components during the surface modification step, a key challenge in conventional ALE processes. By integrating a switch mechanism for a blocking capacitor in a path between a bias unit and a chuck, this method significantly improves etching precision and efficiency. The invention can be readily extended to other etching or deposition applications, wherein a surface modification is required without ion interactions with a substrate surface.