SYSTEM AND METHOD FOR SINGULATION OF SEMICONDUCTOR WORKPIECE
개요
발명자
Praveen SREERAMAGIRI; Ibrahim El KHATIB; Yi LI; Robin McREE; Jesse JONES; Gang DUAN; Manohar KONCHADY; Srinivas PIETAMBARAM; Yekan WANG; Andrew JIMENEZ; Aaron GARELICK
IPC 분류
CPC 분류
There may be provided a system. The system may include a workpiece-support assembly that includes a platform positioned alongside a singulation axis of the system. The system may further include a material-removal assembly that includes a cutter, the cutter positioned over the platform and aligned with the singulation axis. The system may further include an irradiation assembly that includes a laser source oriented towards the singulation axis. The system may further include a separation assembly that includes a separation tool. The separation tool may include a first workpiece-engagement member positioned over a first portion of the platform at a first side of the singulation axis and a second workpiece-engagement member positioned over a second portion of the platform at an opposite side of the singulation axis, or an optical source oriented towards the singulation axis.
원문 (중국어)
There may be provided a system. The system may include a workpiece-support assembly that includes a platform positioned alongside a singulation axis of the system. The system may further include a material-removal assembly that includes a cutter, the cutter positioned over the platform and aligned with the singulation axis. The system may further include an irradiation assembly that includes a laser source oriented towards the singulation axis. The system may further include a separation assembly that includes a separation tool. The separation tool may include a first workpiece-engagement member positioned over a first portion of the platform at a first side of the singulation axis and a second workpiece-engagement member positioned over a second portion of the platform at an opposite side of the singulation axis, or an optical source oriented towards the singulation axis.