MOLDING APPARATUS AND METHOD FOR MAKING AN ELECTRONIC PACKAGE

원문 (중국어)

Abstract A molding apparatus and a method for making an electronic package are provided. The molding apparatus comprises: a top chase; a bottom chase matable with the top chase, wherein the top chase and the bottom chase define together a molding chamber for accommodating a package strip, and the molding chamber comprises a flow input configured to receive a mold fluid and a flow output configured to output the mold fluid after the mold fluid flows through the molding chamber and across the package strip in a flow direction substantially from the flow input to the flow output, wherein the molding chamber further comprises a flow control structure at or close to two side walls of the molding chamber relative to the flow direction to reduce a flow speed of the mold fluid close to the two side walls.