TOOL AND PROCESSES FOR PICK-AND-PLACE ASSEMBLY
개요
출원인
Board of Regents, The University of Texas System; Silicon Metamaterials, Inc.
발명자
Sidlgata V. Sreenivasan; Paras Ajay; Austin Anthis
IPC 분류
CPC 분류
A system for assembling a first substrate to a second substrate. One or more deformable substrate chucks are utilized to match a topography of a bonding surface on the first substrate to a topography of a bonding surface on the second substrate, where a volatile lubricant is utilized during an alignment step.
원문 (중국어)
A system for assembling a first substrate to a second substrate. One or more deformable substrate chucks are utilized to match a topography of a bonding surface on the first substrate to a topography of a bonding surface on the second substrate, where a volatile lubricant is utilized during an alignment step.