DUMMY COMPONENTS IN INTEGRATED CIRCUITS
개요
발명자
James Robert Todd; Umamaheswari Aghoram; Scott A. Johannesmeyer; Mona Eissa; Nikhil Rangaraju; Maja Imamovic
IPC 분류
CPC 분류
Described examples include an integrated circuit having a substrate. The integrated circuit also has at least one dummy cell on the substrate, the dummy cell having at least a first component having an edge in a first layer of components on the substrate and at least a second component in a second layer of components, the second layer of components on the first layer of components and the substrate, wherein no part of the second component is proximate to the edge of the first component. The integrated circuit also has an insulating layer on the first layer of components and the second layer of components, the insulating layer having a first surface opposite to a second surface of the insulating layer on the first layer of components and the second layer of components, wherein the first surface is planarized and a patterned conductor layer on the first surface.
원문 (중국어)
Described examples include an integrated circuit having a substrate. The integrated circuit also has at least one dummy cell on the substrate, the dummy cell having at least a first component having an edge in a first layer of components on the substrate and at least a second component in a second layer of components, the second layer of components on the first layer of components and the substrate, wherein no part of the second component is proximate to the edge of the first component. The integrated circuit also has an insulating layer on the first layer of components and the second layer of components, the insulating layer having a first surface opposite to a second surface of the insulating layer on the first layer of components and the second layer of components, wherein the first surface is planarized and a patterned conductor layer on the first surface.