SEMICONDUCTOR MANUFACTURING METHOD USING WARPAGE DEFORMATION
개요
발명자
Jinyoung LEE; Sunghyup KIM
IPC 분류
CPC 분류
A semiconductor manufacturing method using warpage deformation includes thermally deforming a three-dimensional warpage of a wafer into a two-dimensional warpage of the wafer by adjusting a temperature of each area of a plurality of areas of a stage where the wafer is mounted, chucking the wafer when the three-dimensional warpage of the wafer has been deformed into the two-dimensional warpage of the wafer, and performing a semiconductor process while the wafer is chucked.
원문 (중국어)
A semiconductor manufacturing method using warpage deformation includes thermally deforming a three-dimensional warpage of a wafer into a two-dimensional warpage of the wafer by adjusting a temperature of each area of a plurality of areas of a stage where the wafer is mounted, chucking the wafer when the three-dimensional warpage of the wafer has been deformed into the two-dimensional warpage of the wafer, and performing a semiconductor process while the wafer is chucked.