DEVICE COMPRISING A PACKAGE, A LID FRAME, A THERMAL INTERFACE MATERIAL AND AN ADHESIVE
개요
출원인
QUALCOMM Incorporated
발명자
Yanmei SONG; Chung-Yi CHOU; Sun Woong YUN; Jingyi HUANG; William STONE
IPC 분류
CPC 분류
A device comprising a substrate, a package coupled to the substrate, and a lid frame coupled to the substrate. The package comprises a first integrated device and an encapsulation layer that at least partially encapsulates the first integrated device. The lid frame is further coupled to the first integrated device through a thermal interface material. The lid frame is further coupled to the encapsulation layer through an adhesive.
원문 (중국어)
A device comprising a substrate, a package coupled to the substrate, and a lid frame coupled to the substrate. The package comprises a first integrated device and an encapsulation layer that at least partially encapsulates the first integrated device. The lid frame is further coupled to the first integrated device through a thermal interface material. The lid frame is further coupled to the encapsulation layer through an adhesive.