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기록
PACKAGE SUBSTRATES WITH CORES HAVING SOLID GLASS AND GLASS FIBER PREPREG
발명심사 중
3조회수
20청구항 · 3 독립항
§ Ⅰ
개요
발명자
Brandon Christian Marin; Jeremy D. Ecton; Gang Duan; Srinivas Venkata Ramanuja Pietambaram
IPC 분류
H1L 23/8H1L 23/522H1L 23/528
CPC 분류
H1L23/8H1L23/5226H1L23/5283
In one embodiment, an apparatus (e.g., a package substrate) includes a core with a layer comprising glass fibers in an epoxy material, a solid glass layer above or on the layer comprising glass fibers in the epoxy material, and a dielectric adjacent the solid glass layer.
원문 (중국어)
In one embodiment, an apparatus (e.g., a package substrate) includes a core with a layer comprising glass fibers in an epoxy material, a solid glass layer above or on the layer comprising glass fibers in the epoxy material, and a dielectric adjacent the solid glass layer.