THIN GLASS CORE PANELS IN CIRCUIT DEVICE PACKAGING
개요
발명자
Jeremy Ecton; Kristof Darmawikarta; Brandon Marin; Gang Duan; Srinivas Pietambaram; Benjamin Duong; Soham Agarwal; Kari Hernandez; Pratyush Mishra; Pratyasha Mohapatra; Bohan Shan; Hiroki Tanaka
IPC 분류
CPC 분류
Thin glass cores for integrated circuit (IC) packages. Recesses in a glass core may be selectively etched into a frontside and/or backside of the glass core to locally reduce the thickness of glass. A dielectric material may be applied over the glass to backfill the recesses. The glass may then be further thinned from a same side as the recess to reduce the thickness of regions outside of the recesses. Alternatively, the glass may then be further thinned from a side of the glass opposite the recess to reduce the thickness of regions outside of the recesses and also remove the lesser thickness of glass remaining at the location of the recess. Panels comprising the thin glass core may then be built-up with routing metallization and assembled with IC die.
원문 (중국어)
Thin glass cores for integrated circuit (IC) packages. Recesses in a glass core may be selectively etched into a frontside and/or backside of the glass core to locally reduce the thickness of glass. A dielectric material may be applied over the glass to backfill the recesses. The glass may then be further thinned from a same side as the recess to reduce the thickness of regions outside of the recesses. Alternatively, the glass may then be further thinned from a side of the glass opposite the recess to reduce the thickness of regions outside of the recesses and also remove the lesser thickness of glass remaining at the location of the recess. Panels comprising the thin glass core may then be built-up with routing metallization and assembled with IC die.