ELECTRONIC DEVICE
개요
발명자
Ryohei UMENO; Tomomi SATO; Tomohira KIKUCHI
IPC 분류
CPC 분류
An electronic device includes a conductive support, an electronic element on the conductive support, and a sealing resin covering the electronic element and the conductive support. The sealing resin has a first resin side surface facing in a first direction perpendicular to a thickness direction of the conductive support. The first resin side surface has a first gate mark. The conductive support includes a first region nearest to the first gate mark in the first direction. The first region is positioned inward of the first gate mark in a second direction perpendicular to the thickness direction and the first direction. The first gate mark has a first dimension in the thickness direction. The first gate mark and the first region are spaced in the first direction by a first distance. The ratio of the first distance to the first dimension is less than or equal to 500%.
원문 (중국어)
An electronic device includes a conductive support, an electronic element on the conductive support, and a sealing resin covering the electronic element and the conductive support. The sealing resin has a first resin side surface facing in a first direction perpendicular to a thickness direction of the conductive support. The first resin side surface has a first gate mark. The conductive support includes a first region nearest to the first gate mark in the first direction. The first region is positioned inward of the first gate mark in a second direction perpendicular to the thickness direction and the first direction. The first gate mark has a first dimension in the thickness direction. The first gate mark and the first region are spaced in the first direction by a first distance. The ratio of the first distance to the first dimension is less than or equal to 500%.