HEAT SPREADING AND THERMAL HEAT REMOVAL STRUCTURES
개요
출원인
International Business Machines Corporation
발명자
John Knickerbocker; Keiji Matsumoto; Aakrati Jain; Prabudhya Roy Chowdhury
IPC 분류
CPC 분류
Semiconductor structures are provided in which heat spreading and thermal heat removal are improved by providing one or more heat removal paths in which heat spreading and thermal heat removal occurs leveraging horizontal direction and vertical directions and through reduced resistance of heat removal paths. Notably, heat is spread horizontally to the edges of the semiconductor structures and then the heat is removed vertically (up and/or down) from the semiconductor structures.
원문 (중국어)
Semiconductor structures are provided in which heat spreading and thermal heat removal are improved by providing one or more heat removal paths in which heat spreading and thermal heat removal occurs leveraging horizontal direction and vertical directions and through reduced resistance of heat removal paths. Notably, heat is spread horizontally to the edges of the semiconductor structures and then the heat is removed vertically (up and/or down) from the semiconductor structures.