BACKSIDE POWER DELIVERY NETWORK HEAT DISSIPATION
개요
출원인
International Business Machines Corporation
발명자
HUIMEI ZHOU; Oleg Gluschenkov; Ruilong Xie
IPC 분류
CPC 분류
A structure comprising: a back-end-of-line portion on top of a device, wherein the device comprises a hot circuit and a cold circuit; a wafer on top of the back-end-of-line portion; a backside power distribution network on a side of the wafer; a thermal sink underneath the device and the backside power distribution network; and one or more scaling balls underneath the thermal sink and on top of a laminate.
원문 (중국어)
A structure comprising: a back-end-of-line portion on top of a device, wherein the device comprises a hot circuit and a cold circuit; a wafer on top of the back-end-of-line portion; a backside power distribution network on a side of the wafer; a thermal sink underneath the device and the backside power distribution network; and one or more scaling balls underneath the thermal sink and on top of a laminate.