HEAT DISSIPATION MEMBER, HEATING COMPONENT, ELECTRONIC ASSEMBLY AND DEVICE

원문 (중국어)

Embodiments of the present application provide a heat dissipation member, a heating component, an electronic assembly and a device, and belong to the technical field of heat dissipation. The heat dissipation member is configured for the heating component, and includes a first surface and a second surface which are oppositely disposed along a gravity direction, where the first surface is located above the second surface; an extending direction of at least a part of the second surface is different from a horizontal direction; the first surface is located below the heating component, and the at least a part of the second surface is disposed to be immersed in phase-change cooling liquid.