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기록

POWER MODULE AND METHOD FOR MANUFACTURING SAME

발명심사 중
18청구항 · 2 독립항
§ Ⅰ

개요

IPC 분류

H1L 23/473H1L 21/48H1L 23/15H1L 23/498H1L 23/538H1L 25/16

CPC 분류

H1L23/473H1L21/4853H1L23/15H1L23/49811H1L23/5385H1L23/5386H1L25/162

The present invention relates to a power module and a method for manufacturing the same. The power module of the present invention may include: an upper ceramic substrate and a lower ceramic substrate; and a flow path part positioned between the upper ceramic substrate and the lower ceramic substrate and provided with multiple flow path channels through which a liquid refrigerant passes, wherein the flow path part may be formed of a metal material. According to the present invention, the flow path part is disposed between the upper and lower ceramic substrates so that effective heat dissipation is possible and miniaturization and weight reduction are possible.

원문 (중국어)

The present invention relates to a power module and a method for manufacturing the same. The power module of the present invention may include: an upper ceramic substrate and a lower ceramic substrate; and a flow path part positioned between the upper ceramic substrate and the lower ceramic substrate and provided with multiple flow path channels through which a liquid refrigerant passes, wherein the flow path part may be formed of a metal material. According to the present invention, the flow path part is disposed between the upper and lower ceramic substrates so that effective heat dissipation is possible and miniaturization and weight reduction are possible.