HEAT DISSIPATION STRUCTURE AND SEMICONDUCTOR PACKAGE DEVICE
개요
발명자
Yiqian LUO; Hua ZONG; Jingcheng GE; Shuo LIU
IPC 분류
CPC 분류
The present disclosure relates to a heat dissipation structure and a semiconductor package device. The heat dissipation structure includes: a top cover, including an inner surface and an outer surface that are oppositely disposed; a heat dissipation hole, at least partially disposed within the top cover, the heat dissipation hole including an inlet disposed within the top cover and an outlet exposed at the outer surface, wherein an aperture of the outlet is greater than an aperture of the inlet; and a heat dissipation channel, including a first heat dissipation channel disposed within the top cover and extending through the top cover in a direction parallel to the outer surface, wherein the first heat dissipation channel is in communication with the inlet and is configured to transfer heated fluid to the inlet. The heat dissipation structure according to the present disclosure enhances the heat dissipation effect.
원문 (중국어)
The present disclosure relates to a heat dissipation structure and a semiconductor package device. The heat dissipation structure includes: a top cover, including an inner surface and an outer surface that are oppositely disposed; a heat dissipation hole, at least partially disposed within the top cover, the heat dissipation hole including an inlet disposed within the top cover and an outlet exposed at the outer surface, wherein an aperture of the outlet is greater than an aperture of the inlet; and a heat dissipation channel, including a first heat dissipation channel disposed within the top cover and extending through the top cover in a direction parallel to the outer surface, wherein the first heat dissipation channel is in communication with the inlet and is configured to transfer heated fluid to the inlet. The heat dissipation structure according to the present disclosure enhances the heat dissipation effect.