SEMICONDUCTOR PACKAGING METHOD, SEMICONDUCTOR PACKAGE AND ELECTRONIC DEVICE
개요
발명자
Ming Li
IPC 분류
CPC 분류
A semiconductor packaging method, which utilizes a connection structure and an interconnection device to realize electrical connections between semiconductor devices and a power supply and the interconnection between the semiconductor devices. A capacitor is provided and is located on at least one side of the connection structure, and on at least one side of the interconnection device. Packaging the capacitor inside the semiconductor package and arranging it in a same layer as the connection structure and the interconnection device maintains the size of the semiconductor package, is conducive to miniaturization, shortens the distance between the capacitor and the semiconductor devices, and improving the effect of the capacitor in filtering high-frequency noise in the resulting circuit, which is conducive to improving the working stability of the semiconductor devices.
원문 (중국어)
A semiconductor packaging method, which utilizes a connection structure and an interconnection device to realize electrical connections between semiconductor devices and a power supply and the interconnection between the semiconductor devices. A capacitor is provided and is located on at least one side of the connection structure, and on at least one side of the interconnection device. Packaging the capacitor inside the semiconductor package and arranging it in a same layer as the connection structure and the interconnection device maintains the size of the semiconductor package, is conducive to miniaturization, shortens the distance between the capacitor and the semiconductor devices, and improving the effect of the capacitor in filtering high-frequency noise in the resulting circuit, which is conducive to improving the working stability of the semiconductor devices.