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기록
SEMICONDUCTOR PACKAGE
발명심사 중
6조회수
20청구항 · 3 독립항
§ Ⅰ
개요
발명자
Yeonghyeon GIM; Junho Lee
IPC 분류
H1L 23/498H1L 23/H1L 23/538H1L 25/65H1L 25/18H10B 80/H10D 80/30
CPC 분류
H1L23/49816H1L24/13H1L24/16H1L23/5385H1L25/652H1L25/657H1L25/18H1L2224/13016H1L2224/13082H1L2224/13147H1L2224/13155H1L2224/13611H1L2224/13613H1L2224/13639H1L2224/13647H1L2224/16227H1L2225/6517H1L2225/652H1L2924/3511H10B80/H10D80/30
A semiconductor package may include a package substrate including a substrate pad, a solder ball in contact with a bottom surface of the substrate pad, and a core enclosed by the solder ball. An area of a bottom surface of the core may be larger than an area of a top surface of the core.
원문 (중국어)
A semiconductor package may include a package substrate including a substrate pad, a solder ball in contact with a bottom surface of the substrate pad, and a core enclosed by the solder ball. An area of a bottom surface of the core may be larger than an area of a top surface of the core.