FRAMES FOR GLASS CORE HYBRID PANELS
개요
발명자
Benjamin T. Duong; Pratyush Mishra; Robert A. May; Soham Agarwal; Kristof Darmawikarta; Gang Duan; Jeremy D. Ecton; Jung Kyu Han; Thomas S. Heaton; Kari E. Hernandez; Tarek A. Ibrahim; Andrew Matthew Jimenez; Brandon Christian Marin; Lilia May; Pratyasha Mohapatra; Son Van Nguyen; Srinivas Venkata Ramanuja Pietambaram; Bohan Shan; Hiroki Tanaka; David Vickery; Yekan Wang; Zhixin Xie
IPC 분류
CPC 분류
Architectures and process flows for frames for glass core hybrid panels for semiconductor packaging. The glass core includes a layer of glass defined by a planar area enclosed by one or more edges that are substantially orthogonal to the planar area and at least one through-glass via (TGV) in the layer of glass, substantially filled with a conductive material. The frame comprises a coefficient of thermal expansion (CTE) that can be manipulated based on selection of frame material and/or percentage of copper in the frame material. The frame has a CTE of less than 11. The frame can enclose a panel, sub-panel or wafer and can include one or more cavities therein for respective glass cores.
원문 (중국어)
Architectures and process flows for frames for glass core hybrid panels for semiconductor packaging. The glass core includes a layer of glass defined by a planar area enclosed by one or more edges that are substantially orthogonal to the planar area and at least one through-glass via (TGV) in the layer of glass, substantially filled with a conductive material. The frame comprises a coefficient of thermal expansion (CTE) that can be manipulated based on selection of frame material and/or percentage of copper in the frame material. The frame has a CTE of less than 11. The frame can enclose a panel, sub-panel or wafer and can include one or more cavities therein for respective glass cores.