PACKAGE SUBSTRATE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

원문 (중국어)

Provided is a package substrate that includes a substrate body part, a bonding pad, and a connection wiring that is connected to the bonding pad in a first direction parallel to a surface of the substrate body part. At least a portion of the bonding pad is embedded in the substrate body part. At least a portion of the connection wiring is embedded in the substrate body part. The bonding pad includes an embedding layer embedded in the substrate body part, a first metal layer formed on the embedding layer, and a second metal layer formed on the first metal layer. The first metal layer has an upper surface that is flat.