METHOD OF MANUFACTURING INTEGRATED CIRCUIT (IC) DEVICE HAVING STAND-ALONE FEED-THROUGH VIA AND SYSTEM FOR SAME
개요
출원인
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
발명자
Cheng-Hua LIU; Kuang-Hung CHANG; Guan-Ming HUANG; Hsieh-Ting-Yang CHENG; Yuan-Te HOU
IPC 분류
CPC 분류
A semiconductor device includes a circuit having a first pin; a first conductor extending in a first direction, the first circuit being between a second conductor and a first side of the first conductor; a circuit having a second pin; and a connection to couple a signal between the first pin and the second pin, the connection including: a first conductive element extending in a second direction, the first conductive element connected to the first pin on the first side of the first conductor; a first via structure connecting the first conductive element to a back of the substrate, including a first feed-through via (FTV) on a second side of the first conductor; a second via structure to provide the signal to a front of the substrate, the second via structure including a second FTV; and a second conductive element connected to the second via structure and the second pin.
원문 (중국어)
A semiconductor device includes a circuit having a first pin; a first conductor extending in a first direction, the first circuit being between a second conductor and a first side of the first conductor; a circuit having a second pin; and a connection to couple a signal between the first pin and the second pin, the connection including: a first conductive element extending in a second direction, the first conductive element connected to the first pin on the first side of the first conductor; a first via structure connecting the first conductive element to a back of the substrate, including a first feed-through via (FTV) on a second side of the first conductor; a second via structure to provide the signal to a front of the substrate, the second via structure including a second FTV; and a second conductive element connected to the second via structure and the second pin.