INTEGRATED MMC PACKAGE WITH INDUCTOR AND DIE
개요
발명자
Eugene Lee; Sylvester Ankamah-Kusi; Rajen Murugan; Harshpreet Bakshi
IPC 분류
CPC 분류
An electronic device includes a first metal structure with a first coil extending in a first plane and a first coil terminal, a second metal structure with a second coil extending in a second plane and a second coil terminal, the second plane approximately parallel to the first plane, a semiconductor die with die terminals and opposite first and second sides, the first side attached to the first metal structure and the die terminals extending outward from the second side to a parallel third plane, and a molded magnetic package structure enclosing portions of the first and second coils and a portion of the semiconductor die, wherein the die terminals and the first and second coil terminals are exposed outside the molded magnetic package structure along the third plane.
원문 (중국어)
An electronic device includes a first metal structure with a first coil extending in a first plane and a first coil terminal, a second metal structure with a second coil extending in a second plane and a second coil terminal, the second plane approximately parallel to the first plane, a semiconductor die with die terminals and opposite first and second sides, the first side attached to the first metal structure and the die terminals extending outward from the second side to a parallel third plane, and a molded magnetic package structure enclosing portions of the first and second coils and a portion of the semiconductor die, wherein the die terminals and the first and second coil terminals are exposed outside the molded magnetic package structure along the third plane.