INTERCONNECT STRUCTURE WITH HYBRID BOND ANTI-FUSES
개요
출원인
International Business Machines Corporation
발명자
Nicholas Alexander POLOMOFF; Mukta Ghate Farooq
IPC 분류
CPC 분류
An interconnect structure includes hybrid-bonded first and second interposers. The first interposer has a first surface including a layer of insulation and a BEOL below the layer of insulation. The layer of insulation has a first recess in the layer exposing a metal conductor of the BEOL, and the first recess is filled with a material changing from nonconducting to conducting upon being heated above a predetermined temperature. The layer of insulation has a second recess in the layer exposing a metal conductor of the BEOL, and the second recess is filled with metal. The second interposer has a similar construction. Upon hybrid bonding, the material that changes from non-conducting to conducting forms an anti-fuse.
원문 (중국어)
An interconnect structure includes hybrid-bonded first and second interposers. The first interposer has a first surface including a layer of insulation and a BEOL below the layer of insulation. The layer of insulation has a first recess in the layer exposing a metal conductor of the BEOL, and the first recess is filled with a material changing from nonconducting to conducting upon being heated above a predetermined temperature. The layer of insulation has a second recess in the layer exposing a metal conductor of the BEOL, and the second recess is filled with metal. The second interposer has a similar construction. Upon hybrid bonding, the material that changes from non-conducting to conducting forms an anti-fuse.