INTEGRATED DIE CIRCUIT
개요
출원인
Cirrus Logic International Semiconductor Ltd.
발명자
Lee R. COLEMAN; Omid AMIRI; Rupesh KHARE
IPC 분류
CPC 분류
An integrated circuit (IC) die configured for packaging in a plurality of different IC packages, the IC die comprising: a first set of die contacts positioned in a first region of the integrated circuit die; a second set of die contacts positioned in a second region of the integrated circuit die; a package type contact; and routing circuitry configured to selectively route signals to or from either the first set of die contacts or the second set of die contacts based on a package type signal received at the package type contact.
원문 (중국어)
An integrated circuit (IC) die configured for packaging in a plurality of different IC packages, the IC die comprising: a first set of die contacts positioned in a first region of the integrated circuit die; a second set of die contacts positioned in a second region of the integrated circuit die; a package type contact; and routing circuitry configured to selectively route signals to or from either the first set of die contacts or the second set of die contacts based on a package type signal received at the package type contact.