PACKAGE STRUCTURE AND METHOD FOR FABRICATING THE SAME
개요
출원인
Taiwan Semiconductor Manufacturing Company, Ltd.
발명자
Hung-En HSU; Ping-Tai CHEN; Ming-Wei PENG; Kuo-Ching HSU
IPC 분류
CPC 분류
A method for fabricating a package structure is provided. The method includes forming a first patterned photoresist layer over a first surface of a substrate. The method includes forming a plurality of first connector structures in openings of the first patterned photoresist layer. The method includes removing the first patterned photoresist layer. The method includes forming a solder mask layer over the first connector structures. The method includes performing a surface treatment process to the first connector structures. The method also includes bonding a package component to the substrate via the first connector structures.
원문 (중국어)
A method for fabricating a package structure is provided. The method includes forming a first patterned photoresist layer over a first surface of a substrate. The method includes forming a plurality of first connector structures in openings of the first patterned photoresist layer. The method includes removing the first patterned photoresist layer. The method includes forming a solder mask layer over the first connector structures. The method includes performing a surface treatment process to the first connector structures. The method also includes bonding a package component to the substrate via the first connector structures.