SEMICONDUCTOR PACKAGES WITH INTEGRATED ANTENNAS AND METHOD FOR FORMING THE SAME
개요
발명자
MoonKyu CHUN; HyeonJong KIM; YoungEun SEO
IPC 분류
CPC 분류
A semiconductor package comprises: a package substrate; a semiconductor die mounted on the package substrate and electrically coupled to the package substrate; an encapsulant layer formed on the package substrate to at least encapsulate the semiconductor die; a shielding layer formed on the encapsulant layer to reduce or prevent electromagnetic interference to the semiconductor die from an external environment of the semiconductor package; and an antenna pattern formed on the encapsulant layer; and a set of interconnection structures extending through the encapsulant layer and electrically coupled between the antenna pattern and the package substrate.
원문 (중국어)
A semiconductor package comprises: a package substrate; a semiconductor die mounted on the package substrate and electrically coupled to the package substrate; an encapsulant layer formed on the package substrate to at least encapsulate the semiconductor die; a shielding layer formed on the encapsulant layer to reduce or prevent electromagnetic interference to the semiconductor die from an external environment of the semiconductor package; and an antenna pattern formed on the encapsulant layer; and a set of interconnection structures extending through the encapsulant layer and electrically coupled between the antenna pattern and the package substrate.