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기록

ELECTROMAGNETIC INTERFERENCE SHIELD HAVING MESH GRID GROUND FENCE METALLIZATION PATTERN

발명심사 중
20청구항 · 3 독립항
§ Ⅰ

개요

발명자

Je-Hsiung LAN; Hong-Ming LEE; Jonghae KIM; Kai LIU; Nosun PARK

IPC 분류

H1L 23/552H1L 21/48H1L 23/H1L 23/498

CPC 분류

H1L23/552H1L21/4853H1L21/4857H1L23/49816H1L23/49822H1L23/49838H1L24/16H1L2224/16227H1L2924/15321H1L2924/19105H1L2924/3025

An electronic device includes at least a first radio frequency (RF) path structure and a second RF path structure; and an electromagnetic shield disposed between the first RF path structure and the second RF path structure. The electromagnetic shield comprises a plurality of fence posts extending through at least one dielectric layer and having first ends electrically connected to a common ground metallization layer, and at least one metallization layer overlying the at least one dielectric layer and electrically interconnecting second ends of the plurality of fence posts. The at least one metallization layer interconnects the second ends of the plurality of fence posts in a conductive mesh pattern.

원문 (중국어)

An electronic device includes at least a first radio frequency (RF) path structure and a second RF path structure; and an electromagnetic shield disposed between the first RF path structure and the second RF path structure. The electromagnetic shield comprises a plurality of fence posts extending through at least one dielectric layer and having first ends electrically connected to a common ground metallization layer, and at least one metallization layer overlying the at least one dielectric layer and electrically interconnecting second ends of the plurality of fence posts. The at least one metallization layer interconnects the second ends of the plurality of fence posts in a conductive mesh pattern.