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기록

ELECTRONIC DEVICE

발명심사 중
2조회수
16청구항 · 1 독립항
§ Ⅰ

개요

IPC 분류

H1L 23/552H1L 23/H1L 23/538H1L 25/65H1L 25/16

CPC 분류

H1L23/552H1L23/5384H1L24/16H1L25/655H1L25/16H1L2224/16227H1L2224/16238

An electronic device comprises a first electronic component, a support member including a support surface supporting the first electronic component, a columnar conductor disposed in a direction where the support surface faces with respect to the support member, and a sealing resin formed on the support surface and covering the first electronic component. The columnar conductor includes a conductor top surface facing the same side as the support surface in a thickness direction of the support member. The conductor top surface is covered with the sealing resin.

원문 (중국어)

An electronic device comprises a first electronic component, a support member including a support surface supporting the first electronic component, a columnar conductor disposed in a direction where the support surface faces with respect to the support member, and a sealing resin formed on the support surface and covering the first electronic component. The columnar conductor includes a conductor top surface facing the same side as the support surface in a thickness direction of the support member. The conductor top surface is covered with the sealing resin.