EMBEDDED BRIDGE WITH PROTECTION LAYER FOR VIA FORMATION WITH BUMP PITCH SCALING
개요
발명자
Hiroki TANAKA; Robert Alan MAY; Ching-Wei LEE; Tchefor NDUKUM; Deniz TURAN; Vishal Bhimrao ZADE; Srinivas Venkata Ramanuja PIETAMBARAM; Gang DUAN; Sanjay THARMARAJAH; Suddhasattwa NAD; Qiang LI; Debendra MALLIK
IPC 분류
CPC 분류
Embodiments disclosed herein include an apparatus that comprises a substrate with a component in the substrate, where the component comprises a pad. In an embodiment, a first layer is over the pad, and the first layer comprises silicon and nitrogen. In an embodiment, a second layer is over the substrate, and a via that passes through the first layer and the second layer, where the via contacts the pad.
원문 (중국어)
Embodiments disclosed herein include an apparatus that comprises a substrate with a component in the substrate, where the component comprises a pad. In an embodiment, a first layer is over the pad, and the first layer comprises silicon and nitrogen. In an embodiment, a second layer is over the substrate, and a via that passes through the first layer and the second layer, where the via contacts the pad.