SEMICONDUCTOR PACKAGE INCLUDING SOLDER STRUCTURE AND SEMICONDUCTOR MODULE INCLUDING THE SAME
개요
발명자
Dahee Park
IPC 분류
CPC 분류
A semiconductor device includes a lower substrate. A first pad is disposed on the lower substrate. An upper substrate is disposed on the lower substrate. A second pad is disposed in a lower portion of the upper substrate. A solder structure is disposed between the first pad and the second pad. A coating layer covers at least a portion of an external surface of the solder structure. The solder structure includes a first portion disposed on a first surface that is in contact with the first pad. The first portion has a first solder pattern and a second solder pattern. The second solder pattern surrounds the first solder pattern.
원문 (중국어)
A semiconductor device includes a lower substrate. A first pad is disposed on the lower substrate. An upper substrate is disposed on the lower substrate. A second pad is disposed in a lower portion of the upper substrate. A solder structure is disposed between the first pad and the second pad. A coating layer covers at least a portion of an external surface of the solder structure. The solder structure includes a first portion disposed on a first surface that is in contact with the first pad. The first portion has a first solder pattern and a second solder pattern. The second solder pattern surrounds the first solder pattern.