METHOD AND APPARATUS FOR BONDING WITH CURVED BONDING HEADS
개요
발명자
Mario Johannes Meissl; Anshuman Cherala
IPC 분류
CPC 분류
An apparatus for bonding multiple pluralities of chiplets to a destination substrate includes one or more bonding heads, each bonding head of the one or more bonding heads having a curved surface configured to hold a plurality of chiplets, a destination stage configured to hold the destination substrate, and a controller configured to operate the movement of the one or more bonding heads and the destination stage. The controller includes a plurality of motors configured to drive each bonding head of the one or more bonding heads in at least in the θX, θY, and Z, directions. The curved surface is a convex surface having a curvature bulging towards the destination stage.
원문 (중국어)
An apparatus for bonding multiple pluralities of chiplets to a destination substrate includes one or more bonding heads, each bonding head of the one or more bonding heads having a curved surface configured to hold a plurality of chiplets, a destination stage configured to hold the destination substrate, and a controller configured to operate the movement of the one or more bonding heads and the destination stage. The controller includes a plurality of motors configured to drive each bonding head of the one or more bonding heads in at least in the θX, θY, and Z, directions. The curved surface is a convex surface having a curvature bulging towards the destination stage.