SEMICONDUCTOR MANUFACTURING SYSTEM AND METHOD
개요
발명자
Yi LI; Brandon MARIN; Zhixin XIE; Praveen SREERAMAGIRI; Ibrahim EL KHATIB; Robin McREE; Jesse JONES; Srinivas PIETAMBARAM; Gang DUAN; Manohar KONCHADY
IPC 분류
CPC 분류
There may be provided a system that includes a workpiece-support assembly with a platform. The system may further include an alignment-detection assembly with an optical sensor oriented towards the platform. The system may further include a handling assembly with at least one manipulator positioned along at least a first movement plane that is substantially parallel with the platform or at least a second movement plane that is substantially perpendicular to the platform. The system may further include a bonding assembly with a dispenser positioned over the platform. The system may further include a fiducial-marking assembly with a drill oriented towards the platform. The system may further include a controller electrically connected to each of the optical sensor, the at least one manipulator, the dispenser, and the drill.
원문 (중국어)
There may be provided a system that includes a workpiece-support assembly with a platform. The system may further include an alignment-detection assembly with an optical sensor oriented towards the platform. The system may further include a handling assembly with at least one manipulator positioned along at least a first movement plane that is substantially parallel with the platform or at least a second movement plane that is substantially perpendicular to the platform. The system may further include a bonding assembly with a dispenser positioned over the platform. The system may further include a fiducial-marking assembly with a drill oriented towards the platform. The system may further include a controller electrically connected to each of the optical sensor, the at least one manipulator, the dispenser, and the drill.