BONDING METHOD WITH LOCATION SPECIFIC PROCESSING
개요
발명자
Kevin Ryan; Christopher Michael Netzband; Chimaobi Mbanaso; Adam J. Gildea
IPC 분류
CPC 분류
A method of forming a bonded wafer, where the method includes receiving a first wafer including a first surface characteristic and a second wafer including a second surface characteristic; based on the first surface characteristic, performing a first location specific processing on the first wafer to obtain a first surface-to-be-bonded including a third surface characteristic; and bonding the first surface-to-be-bonded of the first wafer with the second wafer.
원문 (중국어)
A method of forming a bonded wafer, where the method includes receiving a first wafer including a first surface characteristic and a second wafer including a second surface characteristic; based on the first surface characteristic, performing a first location specific processing on the first wafer to obtain a first surface-to-be-bonded including a third surface characteristic; and bonding the first surface-to-be-bonded of the first wafer with the second wafer.