PACKAGE COMPRISING A PACKAGE INTERPOSER AND A LID FRAME WITH AN OPENING
개요
발명자
Yanmei SONG; Jingyi HUANG; Sun Woong YUN; William STONE
IPC 분류
CPC 분류
A device comprising a substrate; a package coupled to the substrate, a second integrated device coupled to the substrate; and a lid frame coupled to the substrate, wherein the lid frame comprises an opening located vertically over the second integrated device. The package comprises a package interposer comprising a first metallization portion; a second metallization portion; a passive device located between the first metallization portion and the second metallization portion; and a first integrated device coupled to the package interposer.
원문 (중국어)
A device comprising a substrate; a package coupled to the substrate, a second integrated device coupled to the substrate; and a lid frame coupled to the substrate, wherein the lid frame comprises an opening located vertically over the second integrated device. The package comprises a package interposer comprising a first metallization portion; a second metallization portion; a passive device located between the first metallization portion and the second metallization portion; and a first integrated device coupled to the package interposer.