SEMICONDUCTOR DEVICE
개요
발명자
Hyungjun JEON; Kwangjin Moon
IPC 분류
CPC 분류
A method of manufacturing a semiconductor package includes preparing a semiconductor wafer including a plurality of first semiconductor chips, wherein each of the plurality of first semiconductor chips includes first pads and a first insulating layer surrounding the first pads, disposing a second semiconductor chip and a third semiconductor chip on each of the plurality of first semiconductor chips, forming an encapsulant sealing at least a portion of each of the second and third semiconductor chips, wherein the encapsulant covers side surfaces of the second opposite pads, and forming bump structures on the second and third semiconductor chips, wherein the bump structures are electrically connected to the first opposite pads and the second opposite pads.
원문 (중국어)
A method of manufacturing a semiconductor package includes preparing a semiconductor wafer including a plurality of first semiconductor chips, wherein each of the plurality of first semiconductor chips includes first pads and a first insulating layer surrounding the first pads, disposing a second semiconductor chip and a third semiconductor chip on each of the plurality of first semiconductor chips, forming an encapsulant sealing at least a portion of each of the second and third semiconductor chips, wherein the encapsulant covers side surfaces of the second opposite pads, and forming bump structures on the second and third semiconductor chips, wherein the bump structures are electrically connected to the first opposite pads and the second opposite pads.